Die/Layer Attach Process Development Staff Engineer
ams OSRAM
Business summary
The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.
Your tasks
$21
Who we are looking for
- Bachelor's Degree in Engineering (Mechanical/ Mechatronic/ Electromechanical), Engineering (Material Science), Physics or equivalent.
- More than 2 years in semiconductor Die Attach/Layer Attach process engineering field.
- Die Attach, Layer Attach process engineering knowledge & hands on skillset in semiconductors or LED manufacturing processes.
- Experience in Process development or New Product Introduction would be an advantage.
- Hands-on and process development experience in FOL related processes e.g. sawing, die attach and wire bond process.
- Strong analytical skill, systematic problem solving approach skill, statistical knowledge with knowledge of Six Sigma is preferred.
- An in-depth knowledge of Microsoft Excel, Word, PowerPoint and JMP is required.
Contact
$22
Skills
- Analytical
- Excel/Numbers/Sheets
- Microsoft powerpoint
- Process improvement


