Equipment Sr Technician/Associate Engineer (Grinding/Dicing/LLO/Bonding)

Business summary

The ams OSRAM Opto Semiconductors business offers high-performance opto semiconductor components and in-depth support for state-of-the-art system solutions based on innovative semiconductor light sources. The Business Unit can look back on almost fifty years of production and development expertise.

Your tasks

• To implements hardware solutions for grinding/ dicing/ LLO/ Bonding process while adhering to manufacturing capabilities. Maintains, enhances, troubleshooting and supports existing tools.
• Conducts troubleshooting and repair of FE machines like dicing/ grinding/ LLO/ Bonder and other sub-tools used in FE production.
• Carry out calibration/ preventive maintenance to the machine and equipment.
• Ensure the availability of materials and spare parts. Maintains records of daily, monthly and yearly maintenance programs.
• Performs other project related to improve production operation. Assist process engineer to carry out evaluation
• Document production equipment and assembly work instruction to hand off from Engineering to Operations

Who we are looking for

• Min. Diploma or equivalent qualification in engineering.
• Min 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.

Contact

What we look for

• Min. Diploma or equivalent qualification in engineering.
• Min 5 years experience in manufacturing environment and maintenance engineering.
• Preferably experience in handling grinding/ dicing/ LLO/ Bonding process.
• Able to communicate in English and Bahasa Malaysia.

Please contact Shin Yih Cheah for further information via [email protected].