Process / Equipment Engineer – PM/CAL, AOI, Sawing, Dicing & Encapsulation

About the role

We are seeking an experienced Process & Equipment Engineer with hands-on experience in semiconductor manufacturing processes and equipment, particularly Preventive Maintenance & Calibration (PM/CAL), AOI/SBJ, Dispensing & Laser Marking, Condux/Takatori Sawing, 3D Laser Printer/AOI, Encapsulation, and Dicing. The successful candidate will be responsible for equipment reliability, process optimization, troubleshooting, qualification, yield improvement, and continuous improvement across semiconductor manufacturing operations.

Key responsibilities

• Support and sustain semiconductor manufacturing processes and equipment to achieve stable production, quality, yield, and productivity.
• Plan, execute, and monitor Preventive Maintenance (PM) and Calibration (CAL) activities.
• Monitor equipment performance, downtime, reliability, and maintenance trends.
• Troubleshoot equipment and process abnormalities and perform Root Cause Analysis (RCA) and corrective actions.
• Support AOI/SBJ process setup, programming, recipe optimization, inspection, and defect analysis.
• Develop and optimize Dispensing and Laser Marking processes and parameters.
• Support Condux/Takatori Sawing processes, including equipment setup, recipe optimization, troubleshooting, and process improvement.
• Support 3D Laser Printer/AOI process setup, inspection parameters, recipe development, and optimization.
• Develop, optimize, and sustain Encapsulation processes and equipment.
• Support Dicing / Wafer Sawing process development, qualification, and yield improvement.

About you

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Manufacturing Engineering or related field.
• 2–5 years of relevant experience in semiconductor, electronics, precision manufacturing, or related industries.
• Hands-on experience with semiconductor manufacturing equipment and processes.
• Strong experience in PM/CAL and equipment troubleshooting.
• Experience in one or more of the following is required: AOI, SBJ, Dispensing, Laser Marking, Sawing, Dicing, 3D Laser Printer, or Encapsulation.
• Knowledge of SPC, DOE, PFMEA, RCA, 8D, CAPA, OEE, and equipment reliability.
• Strong analytical, troubleshooting, and problem-solving skills.
• Good communication and cross-functional teamwork skills.
• Able to work independently in a fast-paced semiconductor manufacturing environment.