Senior Staff Engineer Package Technology

#WeAreIn for jobs that impact everyone's life.

What if your ideas could change the way the world connects, powers up, or thinks?

As a Senior Staff Engineer Package Technology in our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Are you in?

Your role Key responsibilities in your new role

• Serve as the technical expert for lead frame,

substrate, and packing material development projects.

• Design, prepare drawings, and define specifications

for lead frames and substrates based on design guidelines and assembly rules, ensuring manufacturability, quality, and cost effectiveness.

• Collaborate with internal teams and material suppliers

on packing material design, specification, and selection while ensuring manufacturability, quality, and cost effectiveness.

• Drive lead frame, substrate, and packing material

development activities to achieve project milestones, cost targets, and documentation release requirements (specifications, drawings, GIMM, etc.).

• Liaise with SQM and suppliers to ensure fulfillment of

quality requirements, FAI completion, and qualification release for lead frames, substrates, and packing materials.

• Establish design guidelines and requirements for lead

frame, substrate, and packing material specifications.

• Generate technical papers, journals, and patents

related to lead frame, substrate, and package design to enhance technical value.

• Support incoming material quality activities and work

with suppliers and internal teams to resolve technology and quality issues, and drive improvement programs.

• Participate in lead frame and packing material

technology roadmapping, UPEG activities, and material selection to meet roadmap requirements.

Your profile Qualifications and skills to help you succeed

• Bachelor's Degree in Engineering (Semiconductor

Technology, Microelectronics, Automation, Mechanical, Electrical, or Electronics Physics).

• Minimum 7 years of experience in semiconductor

assembly and packaging development, with relevant experience in lead frame and packing material preferred.

• Knowledge of lead frame/substrate design and packing

material development and qualification.

• Knowledge of material physics and properties related

to lead frames, substrates, and packing materials.

• Knowledge of GD&T and material specification

definition.

• Strong analytical and problem-solving skills.
• Basic knowledge of semiconductor packaging, assembly,

and test processes.

• Knowledge of material development, analysis,

qualification, and reliability.

#WeAreIn for driving decarbonization and digitalization. As a global leader in semiconductor solutions in power systems and IoT, Infineon enables game-changing solutions for green and efficient energy, clean and safe mobility, as well as smart and secure IoT. Together, we drive innovation and customer success, while caring for our people and empowering them to reach ambitious goals. Be a part of making life easier, safer and greener. Are you in?

We are on a journey to create the best Infineon for everyone.

We strive to create the best Infineon for everyone by embracing diversity and inclusion. We welcome applicants for who they are and offer a workplace built on trust, openness, respect and equal opportunity.

Our hiring decisions are based on skills and experience. Even if you don’t meet every requirement, we encourage you to apply.

Please let your recruiter know if you need any accommodations during the interview process.

Learn more about our various contact channels and about Diversity & Inclusion at Infineon.